services

Get in touch with our team

Software Engineering

• Firmware programming
• Languages: Assembly, C, C++, C#
• OS: Windows, IOS, Android, Linux
• Digital Signal Processing (DSP)
• Controllers: TI MSP430, Atmel
• Radio transmission
• Bus systems

Mechanical Engineering

• 3D components modelling
• Sealing adapt (O-ring and Ceramics)
• Flow simulations
• 2D component drawings
• Collision calculations
• Rapid prototyping
• Design & Machining of Injection Molds

Electrical Engineering

• Schematic design
• Layout design
• Circuit simulations
• Prototype plantation
• Special tests and approvals
• EMI tests

Chip Design

•Analog Design: Schematic
•Digital Design: Verilog, System Verilog, Schematic
•Analog Simulation
•Digital Simulation

Assembly

• Subassembly
• PCB plantation
• Firmware flashing with special communication devices
• Final assembly
• Labelling: Product and Box

Mechanical Production

• Injection molding
• Mechanical processing: drilling,
surface finishing
• Special tools
• Testing bench assembly

Quality

• Automotive standards: PPAP
• Failure rate requirement: 100 ppm
• Target failure rate in production process: 0
• Pareto table
• Quality inspection in every production phase
• ISO:9001, ISO:14000, ISO:45001

Testing and Calibration

• Calibration
• Product testing: Leakage tests, Flow tests, Temperature tests, Pressure tests • Special tests: Endurance tests, Abrasion tests, Shaking tests, Shock tests
• Final tests