• 3D components modelling • Sealing adapt (O-ring and Ceramics) • Flow simulations • 2D component drawings • Collision calculations • Rapid prototyping • Design & Machining of Injection Molds
Electrical Engineering
• Schematic design • Layout design • Circuit simulations • Prototype plantation • Special tests and approvals • EMI tests
Software Engineering
• Firmware programming • Languages: Assembly, C, C++, C# • OS: Windows, IOS, Android, Linux • Digital Signal Processing (DSP) • Controllers: TI MSP430, Atmel • Radio transmission • Bus systems
